description the avago ACMD-7402 is a miniature duplexer designed for us pcs handsets. the ACMD-7402 is designed with avago technologies film bulk acoustic resonator (fbar) technology, which makes possible ultra-small, high-q filters at a fraction of their usual size. the ACMD-7402 also utilizes avago? innovative microcap bonded-wafer, chip scale packaging technology. this process allows the filters to be assembled in a molded chip-on-board module that is less than 1.3 mm high with a footprint of only 3.8 x 3.8 mm. the ACMD-7402 enhances the sensitivity and dynamic range of pcs receivers by providing more than 54 db attenuation of the transmitted signal at the receiver input and more than 45 db rejection of transmit- generated noise in the receive band. maximum insertion loss in the tx channel is only 3.5 db, which minimizes current drain from the power amplifier. insertion loss in the rx channel is 3.8 db max, improving receiver sensitivity. the excellent power handling capability of the fbar bulk-mode resonators supports the high output power levels needed in pcs handsets while adding virtually no distortion. features miniature size - 3.8 x 3.8 mm footprint size - 1.3 mm max height high power rating size - +33 dbm max tx power lead-free construction specifications performance guaranteed ?0 to +85 c rx band performance (1930.5 ?1989.5 mhz) size - insertion loss: 3.8 db max size - noise blocking: 43 db min tx band performance (1850.5 ?1909.5 mhz) size - insertion loss: 3.5 db max size - interferer blocking: 52 db min applications handsets or data terminals operating in the us pcs frequency band a cmd-7402 miniature pcs band duplexer data sheet functional block diagram tx port 1 rx port 2 ant port 3
2 ACMD-7402 electrical specifications, z 0 = 50 ? , t c [1,2] as indicated ?30 c [2] +25 c [2] +85 c [2] symbol parameter units min typ [3] max min typ [3] max min typ [3] max antenna port to receive port s23 insertion loss in receive band db 3.8 1.5 3.5 3.5 (1930.5 ?1989.5 mhz) ? s23 ripple (p-p) in receive band db 3.0 1.5 2.6 2.6 s22 return loss of receive port db 9.5 9.5 17 9.5 in receive band s23 attenuation in transmit band db 52 52 56 52 (1850.5 ?1909.5 mhz) s23 attenuation 0 ?1600 mhz db 20 31 s23 attenuation in receive 2 nd db 18 19 harmonic band (3861 ?3979 mhz) transmit port to antenna port s31 insertion loss in transmit band db 3.0 1.1 3.0 3.5 [4] (1850.5 ?1909.5 mhz) ? s31 ripple (p-p) in transmit band db 2.3 0.9 2.3 2.8 s11 return loss of transmit port db 9.5 9.5 20 9.5 in transmit band s31 attenuation in receive band db 43 43 48 43 (1930.5 ?1989.5 mhz) s31 attenuation 0 ?1600 mhz db 22 34 s31 attenuation in transmit 2 nd db 8 13 harmonic band (3701 ?3819 mhz) antenna port s33 return loss of antenna port in db 9 9 16 9 receive band (1930.5 ?1989.5 mhz) s33 return loss of antenna port in db 9 9 19 9 transmit band (1850.5 ?1909.5 mhz) isolation transmit port to receive port s21 tx-rx isolation in receive band db 45 45 48 45 (1930.5 ?1989.5 mhz) s21 tx-rx isolation in transmit band db 54 54 58 54 (1850.5 ?1909.5 mhz) notes: 1. t c is the case temperature and is defined as the temperature of the underside of the duplexer where it makes contact with the cir cuit board. 2. min/max specifications are guaranteed at the indicated temperature with the input power to the tx ports equal to or less than +29 dbm over all tx frequencies unless otherwise noted. 3. typical data is the average value of the parameter over the indicated band at the specified temperature. typical values may v ary over time. refer to ?haracterization?section for measurement details. 4. at tx input power between +26 dbm and +29 dbm, the insertion loss at the upper edge of the tx band (1907?1909.5 mhz) will be slightly degraded. from 1907 to 1909.5 mhz, the maximum insertion loss specification at tc = +85 c is guaranteed to +26 dbm input power.
3 absolute maximum ratings [1] parameter unit value storage temperature c 65 to +125 maximum rf input power dbm +33 to tx ports maximum recommended operating conditions [2] parameter unit value operating temperature, tc [3] , c 40 to +100 tx power 29 dbm operating temperature, tc [3] , c 40 to +85 tx power 30 dbm notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. the device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifications. 3. t c is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board. characterization a test circuit similar to that shown in figure 1 was used to measure typical device performance. this circuit is designed to interface with air coplanar (acp), ground- signal-ground (gsg) rf probes of the type commonly used to test semiconductor wafers. the test circuit is a 7 x 7 mm pcb with a well-grounded pad to which the device under test (dut) is solder- mounted. short lengths of 50-ohm microstripline connect the dut to the acp probe patterns on the board. a test circuit with a ACMD-7402 mounted in place is shown in figure 2. s-parameters are then measured using a network analyzer and calibrated acp probe set phase data for s-parameters measured with acp probe circuits are adjusted to place the reference plane at the edge of the duplexer. figure 1. acp probe test circuit figure 2. test circuit with ACMD-7402 duplexer
4 figure 8. antenna port return loss figure 7. tx?x isolation figure 6. tx rejection in rx band and rx rejection in tx band figure 5. tx and rx port return loss figure 4. ant?x insertion loss figure 3. tx?nt insertion loss typical performance at t c = 25 c -4.0 -3.0 -2.0 -1.0 0.0 1850 1860 1870 1880 1890 1900 1910 fr equency [mhz] insert i on loss [db] -4.0 -3.0 -2.0 -1.0 0.0 1930 1940 1950 1960 1970 1980 1990 fr equency [mhz] insert i on loss [db] -25 -20 -15 -10 -5 0 1750 1800 1850 1900 1950 2000 2050 2100 fr equency[mhz] return lo ss [db] -60 -50 -40 -30 -20 -10 0 1750 1800 1850 1900 1950 2000 2050 2100 fr equency[mhz] insert i on loss [db] -80 -75 -70 -65 -60 -55 -50 -45 -40 -35 1750 1800 1850 1900 1950 2000 2050 2100 fr equency[mhz] insert i on loss [db] -25 -20 -15 -10 -5 0 1750 1800 1850 1900 1950 2000 2050 2100 fr equency [mhz] return lo ss [db]
5 figure 12. ant?x low frequency rejection figure 11. tx?nt low frequency rejection figure 10. tx?nt and ant?x wideband insertion loss figure 9. tx?nt rejection at tx second harmonic -40 -30 -20 -10 0 3700 3720 3740 3760 3780 3800 3820 fr equency [mhz] insert i on loss [db] -60 -50 -40 -30 -20 -10 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 fr equency [ghz] insert i on loss [db] -60 -50 -40 -30 -20 -10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 fr equency [ghz] insert i on loss [db] -60 -50 -40 -30 -20 -10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 fr equency [ghz] insert i on loss [db]
6 figure 14. package marking figure 13. package outline drawing h fb y ww dc n n n n tx rx ant p ackage orientation h = ACMD-7402 fb = avago id y = year ww = work week dc = date code nnnn = lot number (product marking) tx 3.8 rx 3.8 ant tx solder mask over vias (2 pls) notes: 1. dimensions in millimeters (mm). 2. tolerance: x.x 0.1, x.xx 0.05 3. package height = 1.3 mm max. 4. contact areas are gold plated. 5. non-ground vias shown for reference only; covered with 0.51 mm ? solder mask. 1.9 rx 2.4 ant 1.9 1.4 0.40 2.8 1.1 1.8 1.4 0.8 0.50 0.1 1.2 lead free lead free
7 figure 16. duplexer superposed on pcb land print figure 15. recommended pcb land print 1.8 1.0 1.0 1.2 1.4 1.2 0.8 0.2 0.4 0.3 0.3 0.6 w t 1.0 1.8 1.2 1.2 1.2 1.2 1.4 0.3 0.3 0.2 0.2 0.4 0.4 0.3 0.3 0.5 0.5 notes: dimensions in millimeters (mm) all vias ? 0.40 angles 45 rf ports are cpw t and w selected for 50 ohms pa ttern centered on duplexer
8 figure 18. duplexer superposed on solder s stencil figure 17. recommended solder stencil package moisture sensitivity feature test method performance moisture sensitivity level (msl) at 260 c j-std-020c level 3 figure 19. verified smt solder profile temperature c 0 0 time, seconds 250 300 100 150 200 250 150 200 300 50 100 50 3.25 1.00 1.00 3.40 notes: 1. dimensions in millimeters (mm). 2. solder stripes (14 pls) are 0.20 wide, pitch. 3. solder pads for i/o are 0.35 x 0.35. 4. stencil pattern is centered on duplexer. 1.63 1.25 2.70 0.40
9 figure 20. smd tape packing figure 21. unit orientation in tape t ape width h fb y ww dc n n n n h fb y ww dc n n n n p ackage pin 1 orientation sprocket holes pocket cavity 1.75 0.10 5.50 0.05 12.00 0.10 8.00 0.10 ? 1.50 (min.) ? 1.55 0.05 4.00 0.10 see note 2 2.00 0.05 a a b b bo ko 5 max. section b-b ao section a-a 5 max. 0.30 0.05 ao bo ko pitch width = 4.10 = 4.10 = 1.45 = 8.00 = 12.00 notes: 1. ao and bo measured at 0.3 mm above base of pocket. 2. 10 pitches cumulative tolerance 0.2 mm.
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries . data subject to change. copyright ? 2006 avago technologies pte. all rights reserved. av01-0261en july 12, 2006 ordering information part number no. of devices container ACMD-7402-blk 25 anti-static bag ACMD-7402-tr1 1000 7-inch reel
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